Made to measure
Designers of imaging systems often have very specific requirements – for example, a specific size, pixel spacing, sensitivity or frame rate, which cannot be provided by the limited selection of CMOS image sensors on the market.
To fill this gap, ISDI provides a complete service for the design and production of custom image sensors. We specialise in small to medium size volumes, where the mainstream semiconductor sensor vendors cannot offer an economically viable solution.
Our technology portfolio includes:
Pixel sizes varying from 5 μm to 200 μm pitch
3-side butting on all standard sensors for tiling into large arrays
Per-column ADC, 10 -16 bit
Pixel architectures from NIR to UV
Radiation-hard design
Unique linear pixel techniques providing dynamic range >90 dB
Dual- or triple-well pixel architecture
Dynamically assigned ROIs
Non-destructive readout (NDR)
Correlated double sampling (CDS)
Proven designs in technologies 180 nm – 350 nm
Fibre optic plate (FOP) bonding
Complete camera/detector designs: Camera Link, 10 GigE and USB3.1 connectivity
Expertise in scintillator technologies
CUSTOM DESIGN CASE STUDIES - click on image for more information:
